- 产品参数
- 图文介绍
- 企业简介
- 企业地址
TO封装管壳/管帽TO encapsulate the shell/cap
应用领域application area:航天工程、集成电路、以及各类光通讯系统Aerospace engineering, integrated circuits, and various types of optical communication systems.
也可根据尺寸和功能要求等进行定制Can also be customized according to size and functional requirements.
产品特点product feature:产品为玻璃和金属烧结密封连接;
材料:可伐合金、不锈钢、无氧铜、钨铜、低碳钢等
绝缘电阻:〉1000MΩ(500V)The product is glass and metal sintered seal connection;
Material: cutting alloy, stainless steel, oxygen free copper, tungsten copper, low carbon steel, etc
Insulation resistance :> 1000mω (500V);;
耐压:〉500V Withstand voltage: > 500V;
漏气速度Leakage speed:≤1X10-9Pa·m3/S;
镀层厚度plating thickness:Ni:2-11μm,Au:0.3-5.8μm;
镀层质量Nickel layer quality:470℃,N2,1min;
- 产品参数
- 图文介绍
- 企业简介
- 企业地址